WebNov 1, 2003 · Abstract A physically based model for dishing during metal chemical mechanical polishing (CMP) is presented. The control of dishing is important for advanced damascene metal interconnect... WebJ. Seo, CMP-related to contaminants: their source and characterization, in Emerging Contaminants, edited by Aurel Nuro (2024) J. Seo, U Paik, Preparation and characterization of slurry for CMP, Chapter 11 in Advances in Chemical Mechanical Planarization (CMP), edited by Prof. S.V. Babu (2016).
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WebNov 14, 2000 · over, dishing of the soft Cu surface and erosion of oxide also reduce the thickness of Cu interconnects and increase the electrical resis-tance. Thus the corresponding mechanisms of planarization, dishing, and erosion must be determined and their impact on process yield must be addressed. Much of the past research on the … WebMigration & Me – Lake County. Grantee: Faith in Place. Grant Award $22,018.00. Matching Funds $22,365.95. Project Total $44,383.95. The Migration & Me program, a current DNR funded project, will continue to educate faith communities and recruit and train volunteers to engage in habitat restoration along the Illinois Lake Michigan coast. smyrna the movie
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